自然科学版
陕西师范大学学报(自然科学版)
化学与材料科学
钨/二氧化硅/脲醛树脂多组分复合材料制备与表征
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李国梁,冯盼盼,李拉爱,刘容容,张颖*
(应用表面与胶体化学教育部重点实验室; 陕西师范大学 化学与材料科学学院, 陕西 西安 710062)
李国梁, 男, 硕士研究生, 主要研究方向为多功能复合材料制备.E-mail:chouyanyu6@163.com.* 通信作者:张颖, 女, 教授,博士,主要从事胶体界面化学方面的研究. E-mail: zhangy@snnu.edu.cn.
摘要:
以钨粉为核芯材料,利用溶胶-凝胶法在其表面包覆二氧化硅壳层;通过硅烷化试剂(APTES)的修饰作用,在酸催化条件下,在钨/二氧化硅表面实施甲醛和尿素的缩聚反应,制备得到具有核-壳结构的钨/二氧化硅/脲醛树脂(W/SiO2/UF)多组分复合材料.通过扫描电子显微镜(SEM)、X-射线衍射(XRD)和傅立叶转变红外(FT-IR)等手段对复合材料的形态、结构和组成等进行了表征.复合材料的导电性测试结果表明,钨粉表面脲醛树脂层包覆后,其电导率由1.7×10-3S/m降低为1.2×10-8 S/m,即钨粉表面包覆层的包覆较为完整、致密, 其导电性接近于绝缘材料.
关键词:
核-壳材料; 钨粉; 二氧化硅; 脲醛树脂
收稿日期:
2011-02-23
中图分类号:
O648文献标志码: A
文献标识码:
A
文章编号:
1672-4291(2012)01-0037-05
基金项目:
陕西省自然科学基金资助项目(2007E106); 陕西师范大学勤助科研创新基金项目(QZZD10037).
Doi:
Preparation and characterization of tungsten/silica/urea-formaldehyde resin multiful-component composite materials
LI Guo-liang, FENG Pan-pan, LI La-ai, LIU Rong-rong, ZHANG Ying*
(Key Laboratory of Applied Surface and Colloid Chemistry, Ministry of Education;College of Chemistry and Materials Science, Shaanxi Normal University, Xi′an 710062, Shaanxi, China)
Abstract:
The SiO2 layer coated on the tungsten powders (W/SiO2) by the sol-gel technique was firstly carried out. After modification of (3-aminopropyl)-triethoxysilane (APTES) onto the W/SiO2 particle surface, W/SiO2/UF multi-component composites with core-shell structures were fabricated via polycondensation between formaldehyde and urea under acidic condition. The morphologies, the structures and the composition of composite materials were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), and Fourier transform infrared spectrometer (FT-IR) techniques. The conductivity of the prepared composite materials significantly decreased from 1.7×10-3 S/m to 1.2×10-8 S/m, after coating of urea-formaldehyde resin layer on the surface of W/SiO2. It was showed that the prepared W/SiO2/UF multi-component composites are of the quite full and dense coating layer, and the conductivity is nearly close to the insulating materials.
KeyWords:
core-shell materials; tungsten powder; silica; urea-formaldehyde resin