Abstract:
Cold sintering process is an extremely low temperature process, with the sintering temperature typically below 300 ℃, which uses a transient liquid phase (such as water, acid solutions and aqueous alkali) and an applied pressure to assist the densification of ceramic powders. The low sintering temperature and short holding time of cold sintering process can effectively solve the difficulties encountered in the interface control, phase stability and composite sintering. This article mainly introduces the sintering mechanism of cold sintering process and the applications in dielectric materials, focusing on microwave dielectrics, ferroelectrics, piezoelectrics, ceramic based composites and multilayer materials. The cold sintering process has realized the densification of various dielectric materials with good properties at extremely low temperatures, which has greatly promoted the progress and development of low temperature sintering technology. It provides a new route for the development of dielectric materials, and is expected to make a breakthrough in the field of high performance dielectric materials with low CO2 emission. However, it is worth noting that cold sintering process is in the early stage. The sintering mechanism is relatively complex and large varieties of material systems are available, so there is still a lot of room for improvement.
