PAN Yue1,YAO Ye1,LIU Shiqing2*
(1 School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;2 College of Physics and Electronic Information Engineering, Zhejiang Normal University,Jinhua 321004, Zhejiang, China)
Abstract:
High temperatures can cause severe degradation in piezoelectric transducer performance. The three-dimensional numerical simulation of the temperature field of different forced convection methods and transducers with improved structure is carried out. The effects of blowing direction, inflow velocity and ambient temperature on heat dissipation of the transducer are compared and analyzed. The numerical simulation results show that the side blowing heat dissipation effect is the best; increasing the wind speed and lowering the ambient temperature can effectively reduce the temperature of the piezoelectric sheet, but when the wind speed exceeds a certain value, its effect on the heat dissipation of the transducer is reduced. Besides, numerical calculations show that the installation of heat dissipating fins fixed on the location of displacement node plane of the transducer may reduces the average temperature of the piezoelectric ceramic of the transducer by approximately 42%.
KeyWords:
forced convection cooling; finned piezoelectric transducer;numerical simulation