自然科学版
陕西师范大学学报(自然科学版)
化学与材料科学
缓蚀剂在镁合金化学机械抛光过程中的作用
杨大林, 卞达, 赵治安, 倪自丰, 赵永武*
(江南大学 机械工程学院, 江苏 无锡 214122)
杨大林,男,硕士研究生,研究方向为表面工程。E-mail:dly616@163.com
摘要:
利用碱性体系抛光液研究了十二烷基苯磺酸钠(SDBS)缓蚀剂对镁合金化学机械抛光过程和抛光效果的影响。采用能谱仪XPS分析缓蚀剂在镁合金表面形成的膜层成分,并通过腐蚀试验、电化学分析和磨粒粒径测试的手段分析了抛光液中SDBS在镁合金化学机械抛光过程中的作用机理。结果表明:当SDBS含量为1.0%时,抛光液中SDBS可有效抑制镁合金在抛光过程中的腐蚀,缓释效果可达91%。SDBS与镁合金通过缩合反应生成保护膜,减小抛光后的表面粗糙度以及点蚀的出现,提高表面质量;另外,SDBS对Al2O3抛光磨粒具有一定的吸附作用。当SDBS含量为1.0%时,能有效抑制Al2O3磨粒团聚,进而对抛光效果产生一定的影响,减少抛光过程中划痕的产生。
关键词:
化学机械抛光; 缓蚀剂; 极化曲线; 去除率; 粗糙度
收稿日期:
2013-11-23
中图分类号:
TQ146.22
文献标识码:
A
文章编号:
1672-4291(2015)02-0048-05doi:10.15983/j.cnki.jsnu.2015.02.321
基金项目:
国家自然科学基金资助项目(51305166,51005102);江苏省自然科学基金资助项目(BK20130143);清华大学摩擦学国家重点实验室开放基金项目(SKLTKF101304);中央高校基本科研业务费专项资金项目(JUDCF13028);江苏省普通高校研究生科研创新计划项目(CXZZ13—0738);中国博士后科学基金项目(20110491366);江苏省博士后科学基金项目(1002028C)
Doi:
Effect of corrosion inhibitor in the chemical mechanical polishing of Mg alloy
YANG Dalin, BIAN Da, ZHAO Zhian, NI Zifeng, ZHAO Yongwu*
(School of Mechanical Engineering, Jiangnan University, Wuxi 214122, Jiangsu, China)
Abstract:
A series of alkaline polishing slurry were used to investigate the effects of corrosion inhibitor,sodium dodecyl benzene sulfonate(SDBS), on Mg alloy. Corrosion test, electrochemical analysis and abrasive article size test were used to study the inhibiting-mechanism of SDBS. The results showed that, SDBS strongly inhibited the corrosion of Mg alloy in polishing slurry. The inhibition efficiency of 1.0% SDBS was more than 91%.SDBS was absorbed on the Mg alloy surface and then formed a protective film by condensation reaction. The protective film decrease the surface roughness, and also increase the friction coefficient in the polishing process. SDBS could be absorbed by Al2O3 polishing particles,which could inhibit the aggregation of particles. Al2O3 abrasive particle agglomeration is suppressed to reduce the scratches in the polishing process when SDBS content is of 1.0%.
KeyWords:
chemical mechanical polishing; corrosion inhibitor; polarization curve; removal rate; roughness